Thermal Interface Materials

thermal interface materials Pure Metal Thermal Interface Materials used in reflow or non-reflow compressible applications. These materials may or may not contain indium. Products consist of liquid metals at room temperature, Heat-Springs® compressible TIMs, Indium Ribbon and Foil, as well as solder preforms and INforms®.

View Heat-Spring® Kits.

Watch the Video “Overview of Heat-Spring® Thermal Interface Material”

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