Thermal Interface Materials

Pure Metal Thermal Interface Materials used in reflow or non-reflow compressible applications. These materials may or may not contain indium. Products consist of liquid metals at room temperature, Heat-Springs® compressible TIMs, Indium Ribbon and Foil, as well as solder preforms and INforms®. View Heat-Spring® Kits. Watch the Video “Overview of Heat-Spring® Thermal Interface Material”

Showing 1–12 of 15 results

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  Thermal Interface Materials

  Heat-Spring for Liquid Immersion Cooling HSHP

  $545.00 Add to cart
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  Thermal Interface Materials

  Liquid Metal Kit

  $450.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSD (0.500″ squares) – 10 pcs

  $270.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSHP (4.00″ squares) – 3 pcs

  $410.00 Add to cart
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  Heat-Spring® Kits

  InSn Heat-Spring® Kit – HSD (1.00″ squares)

  $410.00 Add to cart
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  Heat-Spring® Kits

  InSn Heat-Spring® Kit – HSD (2.00″ squares)

  $480.00 Add to cart
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  Heat-Spring® Kits

  Pure Indium Heat-Spring® Kit – HSD (0.500″ squares)

  $410.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSD (1.00″ squares)

  $470.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSD (1.50″ squares)

  $545.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSD (2.00″ squares)

  $685.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSD (4.00″ squares)

  $820.00 Add to cart
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  Thermal Interface Materials

  Pure Indium Heat-Spring® Kit – HSD (6.00″ squares)

  $1,000.00 Add to cart