Heat-Spring for Liquid Immersion Cooling HSHP


SKU: KITEA-85551 Category:

Indium Corporation has designed geometries of Heat-Spring® thermal interface materials to be compatible on Intel Cascade Lake & Ice Lake Processors as well as other processors.

The kit contains 12 pieces of the HSHP pattern Heat-Spring® in Indalloy® 4 (99.99In) for testing in your thermal application. This material requires a minimum pressure of 40psi. Heat-Spring HSHP pattern is idea for TIM2 applications in air and in immersion cooling.  The 100% Indium element compressible metal TIM will not dissolve in any immersion fluids.

The kit includes 12 pieces of 2” x 2.5” x .006 (.012” after patterning).

Indium Metal TIMs are also 100% recyclable and reclaimable and are a green solution that can be sent back to Indium for value.

Product Document:

What is a TIM? App Note

Weight 0.453592 kg
Dimensions 34.29 × 25.4 × 8.89 cm
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