Heat-Spring® Kits
Indium and indium-contained compressible interface materials used for thermal transfer.
The Heat-Spring® is a patented technology from Indium Corporation. Available here are our bundle packs in many different thicknesses and form factors. All are packaged in tape and reel in a bundle configuration.
Showing all 11 results
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Thermal Interface Materials
Pure Indium Heat-Spring® Kit – HSD (6.00″ squares)
$1,000.00 Add to cart -
Thermal Interface Materials
Pure Indium Heat-Spring® Kit – HSHP (6.00″ squares)
$1,100.00 Add to cart








