Solder Paste
| Price per item | Minimum qty. |
|---|---|
| $ 120.00 | 1+ |
| $ 100.00 | 6+ |
Product Description:
Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today's miniaturization in System-in-Package (SiP) design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low voiding performance on fine-pitch components, including BGA's and CSP's.
Product Documents
Indium Corporation does not recommend, manufacture, market, or endorse any of our products for human consumption.
From One Engineer to Another®
Indium Corporation — ©1996–2018. All Rights Reserved. Read our Privacy Policies.
Indium Corporation reserves the right to modify or cancel this promotion,
or individual orders, due to system error, fraud, or other unforeseen problems.
Any non-REACH compliant items in this store will not be shipped to any EU countries.
If you have a concern that the product you are ordering is not REACH compliant, please email us at Europe@indium.com.
Shopping Cart:
Your cart is empty.
Americas
Utica, Rome, Chicago, Clinton
E-Mail: askus@indium.com
Phone: +1 315 853 4900
Asia/Pacific
Singapore, Cheongju
E-Mail: asiapac@indium.com
Phone: +65 6268 8678
Penang
E-Mail: techhub@indium.com
Malaysia Tech Hub: www.indium.com/malaysia-tech-hub/
China
Suzhou, Shenzhen
E-Mail: china@indium.com
Phone: +86 (0)512 628 34900
Europe
Milton Keynes, Torino
E-Mail: europe@indium.com
Phone: +44 (0)1908 580400
Connect with Indium.
Read our latest posts!