Solder Paste

Solder Paste:

Indium Corporation offers a wide selection of no-clean pastes, water-wash pastes, and solder pastes. Besides having a selection of over 220 alloys, Indium Corporation offers several flux types that encompass a variety of more fine-tuned formulations.

When purchasing paste products, you must select overnight shipping.

  • Indium6.3 Halide-Free:  Water WashIndium6.3 Halide-Free: Water Wash

    IPN: Pasteot-800463

    Price: $105.00

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    Price: $105.00

    Indium6.3 is a halide free, low voiding, water soluble solder paste. Indium6.3 has excellent wetting and solder joint appearance, exceptional printing and response to pause with a wide reflow profile window. Indium6.3 has outstanding slump resistance Details…

  • NC-SMQ92J Halide-Free: Air Reflow: No-Clean Solder Paste NC-SMQ92J Halide-Free: Air Reflow: No-Clean Solder Paste

    IPN: Pasteot-82320

    Price: $105.00

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    Price: $105.00

    NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent fine pitch deposition. Details…

  • SAC305  .030SAC305 .030

    IPN: rectangleto-152145-1K

    Price: $250.00

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    Price: $250.00

    SAC305 solder fortication preforms .030" x .060" x .031" packaged 1000 pieces/7" tape and reel

    Lead-time is 5 working days after placing order Details…

  • SAC305 .020 x .040SAC305 .020 x .040

    IPN: rectangleto-155006-1K

    Price: $250.00

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    Price: $250.00

    SAC305 .020" x .040" x .019" preforms packed 1000 pieces/7" tape and reel

    Lead-time: 5 working days after placing order to ship Details…

  • SAC305 Indium3.2 Pb-Free Water Soluble Solder PasteSAC305 Indium3.2 Pb-Free Water Soluble Solder Paste

    IPN: pasteot-800164

    Price: $120.00

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    Price: $120.00

    Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding performance on fine-pitch components, including BGA's and CSP's. Details…

  • SAC305 Indium8.9E Pb-Free solder pasteSAC305 Indium8.9E Pb-Free solder paste

    IPN: pasteot-800514

    Price: $120.00

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    Price: $120.00

    Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium 8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.

    Details…

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