Solder Flux:
Indium Corporation design and manufactures innovative flux materials for virtually all applications where flux is required, including rework and repair, wave soldering, surface mount, mixed technology, and through-hole electronic assembly.
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Indium Hi Grade Wave Solder Flux 1075 VOC-FreeIPN: Fluxwv-84249-01-5galCON
Price: $125.00
Indium Hi Grade Wave Solder Flux 1075 VOC-Free is a non-halide, rosin/resin free flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assembly. Details…
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Indium Hi Grade Wave Solder Flux 3590-TX No ResidueIPN: Fluxwv-84253-01-5galCON
Price: $125.00
Indium Hi Grade Wave Solder Flux 3590-TX No Residue is a non-halide, rosin/resin free designed to eliminate post-cleaning operations. Very effective flux activators provide superior solderability reduced defects and shiny solder joint formation. Details…
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Solder Flux PenIPN: Fluxot-84191-01-10gPEN
Price: $5.00
The Flux Pen is designed with controlled release of flux for touch-up, light assembly work. The user friendly pin-point application of flux makes it simple to reach difficult areas. This application makes touch-up and repair an easier task. Details…
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TACFlux 10 No-Clean FluxIPN: Fluxot-84166-25g30SY
Price: $150.00
TACFlux 10 is a no-clean flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where flux is required. Details…
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TACFlux 22 Water-Soluble FluxIPN: Fluxot-84261-25g30SY
Price: $150.00
TACFlux 22 is a water soluble flux designed ti be used in rework and repair, SMY component attachment, and virtually all applications where fluxes are required. Details…
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SAC305 Indium3.2 Pb-Free Water Soluble Solder PasteIPN: pasteot-800164
Price: $120.00
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding performance on fine-pitch components, including BGA's and CSP's. Details…
