SAC305 Indium3.2 Pb-Free Water Soluble Solder Paste
IPN: pasteot-800164
Price: $120.00
| Price per item | Minimum qty. |
|---|---|
| $ 120.00 | 1+ |
| $ 100.00 | 6+ |
| Document | Filename |
|---|---|
| Indium 3.2 - MSDS | Indalloy with Indium3.2.pdf |
| Indium 3.2 - PDS | Indium3.2 Pb-Free Solder Paste 98180 R6.pdf |
Product Description:
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today's high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding performance on fine-pitch components, including BGA's and CSP's.