Indium and indium-contained compressible interface materials used for thermal transfer.
The Heat-Spring® is a patented technology from Indium Corporation. Available here are our bundle packs in many different thicknesses and form factors. All are packaged in tape and reel in a bundle configuration.
Indium Corporation does not recommend, manufacture, market, or endorse any of our products for human consumption.
From One Engineer to Another®
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All items ordered within this store are REACH Compliant.