Heat-Spring®:

Indium and Indium Contained Compressible Interface Materials used for Thermal Transfer.
The Heat-Spring® is a patented technology from Indium Corporation, Available here is our Bundle Packs in many different thicknesses and Form Factors. All are packaged in Tape and Reel in a Bundle Configuration.

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  Thermal Interface Ribbon Kit

  IPN: KITEA-85529

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  Heat-Spring® Bundle Pack: Squares: .5 Inch Squares - Qty 100 Pieces

  IPN: KITEA-85532

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  Heat-Spring® Bundle Pack: Squares: 1 Inch Squares: Qty 50 Pieces

  IPN: KITEA-85536 7

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  Heat-Spring® Bundle Pack: Squares: 1.5 Inch Squares - Qty 20 Pieces

  IPN: KITEA-85535

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  Heat-Spring® Bundle Pack: Squares: 2 Inch Squares: Qty 20 Pieces

  IPN: KITEA-85533 4 9 85542

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